Semiconductor memory drive

ABSTRACT

In a semiconductor memory device comprising memory cells in which first and second potentials correspond to the logic values &#34;0&#34; and &#34;1&#34;, the first potential is closer to the second potential than the potential of unselected word lines, by 0.3 V or more. The pull-up transistor is of the N-type, and the pull-down transistor is of the P-type.

BACKGROUND OF THE INVENTION

1. Field of the Invention

This invention relates to a semiconductor memory device, and moreparticularly to a dynamic random access memory device (DRAM).

2. Description of the Prior Art

FIG. 5 illustrates schematically a DRAM comprising memory cells. Amemory cell which is indicated by a broken-line circle 10 in FIG. 5 iscomposed of an MOS transistor and a capacitor. The configuration of aconventional DRAM will be described by illustrating the operation of theDRAM. When a row decoder 20 selects one of word lines (e.g., a word line40), according to an address signal input from outside the semiconductorchip, the signal charges written into memory cells are read out to bitlines /BIT₁ -/BIT_(N), respectively, and slight differences in potentialoccur between bit lines /BIT₁ and BIT₁, . . . and /BIT_(N) and BIT_(N).These slight differences in potential are amplified by sense amplifiersSA₁ to SA_(N) to be output, while their respective signal charges arewritten back into the same memory cells. In FIG. 5, numeral 70 indicatesa pull-up wire for driving the sense amplifiers SA₁ to SA_(N), and 60 isa pull-down wire. The DRAM of FIG. 5 has a memory cell array of theso-called "folded-bit" type in which there are memory cells at half ofthe word line and bit line intersections. The coupling capacitancesbetween the word line 30 and bit lines (BIT_(i) and /BIT_(i)) are C_(i)on the side where a memory cell is connected, and /C_(i) on the sidewhere a memory cell is not connected.

When data of the memory cells connected to the word line 40 are readout, amplified and rewritten, depending on the read-out data pattern,coupling noises from the bit lines may enter the unselected word line30, thus destroying the data in memory cells M3₁, . . . , M3_(i), . . .M3_(N) connected to the unselected word line 30. Below is a detaileddescription of this phenomenon.

FIG. 6 shows the structure of the part enclosed by a broken line 50 inFIG. 5. In FIG. 6, numeral 500 is a silicon substrate. The word lines 30and 40 are formed from polysilicon, and the bit line /BIT_(N) is formedfrom aluminum or other material. 501 and 502 are SiO₂ films, and 503 isa gate oxide film. 504 is an oxide film constituting the cellcapacitance, 53 is a cell plate, 52 is a cell capacitance node, 51 isthe source area to which the bit line /BIT_(N) and the MOS transistorM4_(/N) are connected, and 54 is a field oxide film. The couplingcapacitances C_(i) and /C_(i) can be expressed by

    C.sub.i =C.sub.GS +C.sub.CW +C.sub.O

    /C.sub.i =C.sub.O

where C_(GS) is the capacitance between the gate and source of theswitching transistor in the memory cell, C_(CW) is the couplingcapacitance between the bit line /BIT_(N) and the word line 40 in thecontact part of the bit line /BIT_(N), and C_(O) is the couplingcapacitance between the bit line /BIT_(N) and the word line 30 or 40.Form the above expressions, the relation C_(i) >/C.sub. i can be easilyseen.

As the degree of integration of semiconductor devices has increased inrecent years, the gate oxide film of MOS transistors has tended tobecome thinner Therefore, the capacitance C_(GS) has tended to increase.On the other hand, the introduction of self-aligned contacts due todecreased planar surface areas has brought bit lines and word linescloser and closer together in the contact areas, and as a result, thecapacitance C_(CW) also has tended to increase in recent years,resulting in C_(i) >>/C_(i). In other words, among the couplingcapacitances between word lines and bit lines, the capacitance at theside on which the memory cell is connected is tending to becomeexcessively large.

With reference to FIG. 7, the operation of the memory device shown inFIG. 5 will be described. In FIG. 7, curve a depicts the change inpotential in the selected word line 40. It is assumed that "1" or "0"has been written in all the memory cells M4 _(/1) -M4_(/N) connected tothe selected word line. When "1" is written in all the selected memorycells M4_(/1) -M4_(/N), the change in potential in the bit lines /BIT₁-/BIT_(N) connected to the selected memory cells is illustrated by thewaveform indicated by c in FIG. 7, and the change in potential in thecomplementary bit lines BIT₁ -BIT_(N) by the waveform b in FIG. 7. Inother words, in FIG. 7, the bit line pairs (BIT₁ and /BIT₁ -BIT_(N) and/BIT_(N) ) are precharged from time 0 to time T1. At time T1, the wordline potential begins to rise, and the signal charges stored in thememory cells generate a slight potential difference, ΔV₁ or ΔV_(O)(shown in FIG. 7), corresponding to "1" or "0". At time T2, the signalsare amplified by the sense amplifiers SA₁ -SA_(N), as shown in FIG. 7.At time T3, the potential in the word line begins to drop, completingthe rewriting of the data in the memory cells. Precharge then begins attime T4 in preparation for the next read-out cycle. In contrast, when"0" is written in all the selected memory cells M4_(/1) -M4_(/N)connected to the selected word line 40, the change in potential in thebit lines /BIT₁ -/BIT_(N) connected to the selected memory cells is asindicated by waveform b in FIG. 7, and the change in potential in thecomplementary bit lines BIT₁ -BIT_(N) as indicated by the waveform c inFIG. 7.

Since the coupling capacitance on the side where the memory cell isconnected is larger (i.e., C_(i) >>/C_(i)) as described above, thedifference, ΔC=C_(i) -/C_(i), becomes a capacitance contributing to thegeneration of noises entering the word lines from the bit line. Thenoise entering the unselected word line 30 are indicated by broken linesd and d' in FIG. 7. These noises correspond respectively to the portionsNc and Nb of the waveforms c and b in FIG. 7. That is, when rewriting orprecharging a memory cell (e.g., the cell M4_(/1)), noises are generatedin the unselected word line 30. These noises cause the destruction ofthe data in the memory cells (e.g., the cell M3₁) connected to theunselected word line 30. This will be discussed in more detail below.

FIG. 8A shows the equivalent circuit of a memory cell, and FIG. 8B is agraph illustrating the cutoff characteristic of a switching transistor,i.e., a so-called Vg-logI_(D) graph. The current characteristic in anarea below the threshold voltage V_(T) in the Vg-logI_(D) graph (area Sin FIG. 8B) is referred to as the sub-threshold area, and has asignificant effect on the holding characteristic of the memory cell.This is because, when the word line potential (i.e., the gate potential)rises transiently due to the above-mentioned noise, and even if thisincreased potential does not reach the threshold voltage V_(T), thecurrent flowing through the transistor increases logarithmically,resulting in an outflow of the signal charge. This causes thedegradation of the holding characteristic.

In the prior art, this problem is dealt by designing a memory device sothat the slope of the subthreshold area S of the switching transistor issteeper, and that the number of memory cells connected to a word line isreduced to decrease the coupling capacitance between the bit lines andword lines. However, these measures have become more difficult as thedegree of integration of memory chips increases. That is, as the degreeof integration increases, the structure of transistors becomes morecomplex and the number of design parameters to be controlled increasesmarkedly. As a result, optimizing only the sub-threshold area becomesdifficult. Further, reducing the number of memory cells connected to aword line and increasing the number of array divisions in a memory chiprequire that the area of the chip be increased.

As described above, noises caused by the coupling between bit lines andunselected word lines in a prior art semiconductor memory device producea serious problem that data stored in memory cells connected to theunselected word lines are destroyed.

SUMMARY OF THE INVENTION

The semiconductor memory device of this invention, which overcomes theabove-discussed and numerous other disadvantages and deficiencies of theprior art, comprises memory cells in which first and second potentialscorrespond to the logic values "0" and "1", respectively, said firstpotential being closer to said second potential than the potential ofunselected word lines, by a predetermined value.

In a preferred embodiment, the predetermined value is 0.3 V or more.

According to the invention, a semiconductor memory device comprising asense circuit to which first and second bit lines are connected at firstand second nodes, respectively, and the sense circuit comprises: a firstMOS transistor of a first conductivity type connected between a firstvoltage line and a third node; second and third MOS transistors of asecond conductivity type, the source and drain of said second MOStransistor being connected between said first and third nodes, thesource and drain of said third MOS transistor being connected betweensaid second and third nodes; a fourth MOS transistor of the secondconductivity type connected between a second voltage line and a fourthnode; and fifth and sixth MOS transistors of the first conductivitytype, the source and drain of said fifth MOS transistor being connectedbetween said first and fourth nodes, the source and drain of said sixthMOS transistor being connected between said second and fourth nodes, thegate of said second and fifth MOS transistors being connected to saidsecond nodes, the gate of said third and sixth MOS transistors beingconnected to said first node.

According to another embodiment of the invention, a semiconductor memorydevice comprising a sense circuit to which first and second bit linesare connected at first and second nodes, respectively, the sense circuitcomprises: a first MOS transistor of a first conductivity type connectedbetween a first voltage line and a third node; second and third MOStransistors of the first conductivity type, the source and drain of saidsecond MOS transistor being connected between said first and thirdnodes, the source and drain of said third MOS transistor being connectedbetween said second and third nodes; a fourth MOS transistor of a secondconductivity type connected between a second voltage line and a fourthnode; and fifth and sixth MOS transistors of the second conductivitytype, the source and drain of said fifth MOS transistor being connectedbetween said first and fourth nodes, the source and drain of said sixthMOS transistor being connected between said second and fourth nodes, thegate of said second and fifth MOS transistors being connected to saidsecond nodes, the gate of said third and sixth MOS transistors beingconnected to said first node.

Thus, the invention described herein makes possible the objectives of

(1) providing a semiconductor memory device in which the destruction ofdata in memory cells caused by the capacitance coupling between a bitline and a word line can be effectively prevented from occurring;

(2) providing a semiconductor memory device which is highly reliableeven when the memory is of a very large scale integrated type;

(3) providing a semiconductor memory device which is not easily affectedby the substrate noise caused by peripheral circuits; and

(4) providing a semiconductor memory device which does not require aninternal voltage generating circuit.

BRIEF DESCRIPTION OF THE DRAWINGS

This invention may be better understood and its numerous objects andadvantages will become apparent to those skilled in the art by referenceto the accompanying drawings as follows:

FIG. 1 is a circuit diagram showing the construction in the vicinity ofa sense amplifier in a memory device according to the invention.

FIG. 2 illustrates waveforms at portions of the embodiment of FIG. 1.

FIGS. 3A and 3B are diagrams for illustrating the potential rise in aword line.

FIG. 3C is a partial sectional view of a memory device.

FIG. 4 is a graph showing the potential rise of a word line in theembodiment of FIG. 1.

FIG. 5 is a diagram for illustrating a memory device.

FIG. 6 is a sectional view of a memory cell.

FIG. 7 is a graph for showing the potential rise of a word line in aprior art device.

FIG. 8A shows an equivalent circuit of a memory cell.

FIG. 8B is a graph showing the switching characteristic of a transistor.

FIG. 9 is a diagram illustrating the vicinity of a sense amplifier in aconventional memory device.

DESCRIPTION OF THE PREFERRED EMBODIMENTS

According to the invention, the potential of memory cell contentscorresponding to the logic value "0" differs by 0.3V or greater fromthat of unselected word lines. Even if the rise of the potential ofunselected word lines is caused by the capacitance coupling between bitlines and word lines, consequently, the potential of unselected wordlines does not exceed that of memory cell contents corresponding to thelogic value "0".

FIG. 2 shows waveforms in a semiconductor memory device according to theinvention. Unlike conventional devices, the potential of memory cellcontents corresponding to logic value "0", i.e., the rewrite voltagecorresponding to the logic value "0", is higher by the amount indicatedby V_(B) in FIG. 2. Therefore, even if the potential of unselected wordlines rises momentarily as indicated by curve d' in FIG. 2 due to thecapacitance coupling between the bit lines and the word lines, it doesnot exceed the potential of the memory cell contents corresponding tothe logic value "0", thereby preventing data from being destroyed. It ispreferable that the value of the voltage difference V_(B) is equal to orgreater than 0.3 V, as described below. FIG. 3A shows the relationshipbetween a word line 33 and bit lines 55. The word line 33 in FIG. 3Awhich is formed by polysilicon corresponds to the word line 30 or 40 inFIG. 5, and the bit lines 55 to the bit lines BIT₁ -/BIT_(N) in FIG. 5.Numeral 11 represents a memory cell, and 44 a word line driver circuit.When the word line 33 is not selected, the potential in the majority ofthe bit lines 55 increases, and the coupling capacitance C_(i) causesthe potential in the unselected word line 33 to increase, resulting indestruction of data. The equivalent circuit used to demonstrate this isshown in FIG. 3B.

In FIG. 3B, numeral 200 is a MOS transistor on the pull-down side in theword line driver circuit 44, and numeral 34 is an aluminum wiring which,as shown in FIG. 3C, runs on an insulating film 600 and parallel to theword line 33. The aluminum wiring 34 is electrically connected atintervals with the word line 33 by conductors 35 to reduce the word linedelay in the DRAM. The resistance of each section of the aluminum wiring34 is indicated by RAL in FIG. 3B. Using this equivalent circuit, theinventors estimated the circuit parameters for a 16M DRAM to find therelationship between the channel width W_(N) of the pull-down transistor200 and the voltage difference V_(B) in the word line under theconditions described below. The result is shown in FIG. 4.

This simulation was performed using the circuit simulator SPICE. Themaximum rise rate of the potential of a bit line (i.e., the portionN_(c) in FIG. 2) was about 10⁸ V/S. The sheet resistance of polysiliconwas 50 Ω/□, and that of the aluminum wiring 0.05 Ω/□. The width of boththe polysilicon and aluminum wires was 0.7 μm, and the channel length ofthe pull-down transistor 200 was 0.7 μm. The coupling capacitance C_(i)between a word line and a bit line was about 2 fF/bit. The number ofmemory cells connected to one word line was 2048.

As can be seen from FIG. 4, even if the channel length W_(N) of thepull-down transistor is large, the rise of potential in the word line 33(broken line in FIG. 4, potential at portion B in FIG. 3B) does notbecome smaller than the rise of potential in the aluminum wire 34 (solidline in FIG. 4, potential at portion A in FIG. 3B) running parallel tothe word line, and converges at a fixed value of approximately 200 mV.In an actual DRAM circuit, the channel length W_(N) is greater thanabout 10 μm, in which case the maximum rise in potential of the wordline is less than 300 mV. From this, it can be seen that it issufficient to raise the potential of the memory cell contentscorresponding to a logic value of "0" by 0.3V or more from that of anunselected word line.

Before describing the embodiment in more detail, the relationshipbetween a sense amplifier and a sense amplifier control circuit(commonly referred to as a pull-down transistor and a pull-uptransistor) is explained for the sake of better understanding of theembodiment. In most DRAMs, currents are pulled down and pulled up fromthe sense amplifiers SA₁ -SA_(N) through the common lines 60 and 70(FIG. 5).

With reference to FIG. 1, an embodiment of a circuit configuration forrealizing the above-described condition will be described. Theembodiment shown in FIG. 1 is characterized in that a pull-downtransistor M₄ has a P-channel so that the potential rise of a word linecan be prevented from occurring. As mentioned before, a pull-uptransistor in a conventional device has an N-channel. In the embodimentof FIG. 1, a first bit line BIT is connected to a first node 1, and asecond bit line /BIT to a second node 2. The source and drain of anN-channel MOS transistor M₁ are connected to a third node 3 and a firstpower supply line 5. The third node 3 corresponds to the common pull-upline 70 shown in FIG. 5. A P-channel MOS transistor M₂ is connectedbetween the nodes 1 and 3, and a P-channel MOS transistor M₃ between thenodes 2 and 3. The source and drain of a P-channel MOS transistor M₄ areconnected to a second power supply line 6 (in this embodiment, a groundline) and a fourth node 4 which corresponds to the common pull-down line60. An N-channel MOS transistor M₅ is connected between the nodes 1 and4, and an N-channel MOS transistor M₆ between the nodes 2 and 4. Thegates of the transistors M₂ and M₅ are connected to the node 2, and thegates of the transistors M₃ and M₆ to the node 1. The MOS transistorsM₂, M₃, M₅ and M₆ constitute a sense amplifier having a CMOS typeflip-flop circuit, which corresponds to the sense amplifiers SA₁ -SA_(N)shown in FIG. 5. The sense amplifier of the embodiment differs fromconventional sense amplifiers in that the pull-up transistor M₁ is ofthe N-type instead of the P-type, and that the pull-down transistor M₄connected to the minus (ground) level 6 is of the P-type instead of theN-type.

When the voltage of the first power supply line 5 is 5V and that of thesecond power supply line 0V, the potentials of the bit lines BIT and/BIT in a memory device using the sense amplifier shown in FIG. 1 changeas indicated by curve c and b in FIG. 2, respectively.

In the memory device according to the invention, the potentialdifference V_(B) between the potential of an unselected word line andthat of a memory cell storing the logic value "0" equals the thresholdvoltage V_(TP) of the P-channel MOS transistor M₄ (which is about 1V)because of the following reason. The node 4 is connected to the sourceof the P-channel MOS transistor M₄, and the transistor M₄ is driven byapplying the voltage of 0V to the potential of the gate G₄. Since thecircuitry including the transistor M₄ constitutes a so-called sourcefollower circuit, however, the potential of the node 4 cannot be loweredbelow the threshold voltage V_(TP) (about 1V).

When the potential of a selected word line at the word line selection isset to the same level as that of the plus power supply, the potentialdifference V_(U) between the potential level at the word line selectionand the memory cell potential corresponding to the logic value "1" isequal to the threshold voltage V_(TN) (about 1V) of the N-channel MOStransistor M₁. The maximum voltage appearing across the source and drainof a switching transistor of a memory cell can be selected to be 3V.This results in the improved reliability of the transistor because atransistor in which a greater voltage is applied between the source anddrain deteriorates more rapidly. In the prior art, as shown in FIG. 9,an external power supply voltage V_(ccext) (=5 V) is reduced to aninternal voltage V_(int) (=3V) by a down converter 90, and the internalvoltage V_(int) is applied to a pull-up transistor 91 so that arelatively low voltage is supplied to bit lines BIT and /BIT. Thiscauses the source-drain voltage of a switching transistor to become 3V,thereby assuring the reliability of the transistor. Such a conventionalconfiguration in which a down converter is used has various drawbackssuch as the down converter occupies a substantially large area, the downconverter consumes power, and wirings for both V_(ccext) and V_(int) arerequired to be formed in an LSI chip. The present invention caneliminate also these drawbacks.

As seen from above, in the preferred embodiment, the potential of amemory cell the contents of which corresponds to logic value "0" can beeasily raised by 0.3V or more above the potential of a unselected wordline.

The present invention exhibits another advantage that a semiconductormemory device is not easily affected by substrate noises caused fromperipheral circuits. When the potential of a substrate is increased by anoise from a peripheral circuit to cause the potential of a memory cellhaving a PN diode and formed in the substrate to exceed the turn-onvoltage (about 0.6V) of the diode, data stored in a memory cell (e.g.,"0" V) of a conventional memory device is destroyed. In contrast,according to the invention, the potential of a memory cell the contentsof which corresponds to logic value "0" is set to be greater by 0.3V ormore than the potential of a substrate voltage. Therefore, in the memorydevice of the invention, the destruction of data does not occur untilnoises accumulate in the substrate to produce a potential higher thanthe sum of 0.6V and 0.3V (i.e., a value from 0.9V to 1V).

In the above-illustrated embodiment, an N-channel transistor is used asthe transistor M₁ so that the maximum source-drain voltage of thetransistors constituting the sense amplifier is reduced, therebyincreasing the reliability of the transistors. When the memory device isdesigned so as to be provided with sufficient reliability, the pull-uptransistor may be a P-type one. In this case, the sense circuitryoperates at a high speed.

In the embodiment, the sense amplifier has a CMOS type flip-flopcircuit. When the pull-down transistor at the side of the minus (ground)voltage supply is of the P-type instead of the N-type, the senseamplifier may consist of NMOS transistors only.

When a P-type transistor is used as the switching transistor in a memorycell, a memory device according to the invention can be realized byreplacing the conductivity type of each transistors described above withthe other conductivity type and also by replacing the connectingposition of the voltage supply lines with each other. In this case, thepositions of the power source and the ground in FIG. 1 are replaced witheach other, and the power source generates a negative voltage. Thepotential of the word line ranges from 0V to -5V. When the potential ofthe word line is 0V, the memory cell is unselected, and, when thepotential is -5V, the memory cell is selected. The potential of the bitline ranges from -1V (:"0") to -4V (:"1").

It is understood that various other modifications will be apparent toand can be readily made by those skilled in the art without departingfrom the scope and spirit of this invention. Accordingly, it is notintended that the scope of the claims appended hereto be limited to thedescription as set forth herein, but rather that the claims be construedas encompassing all the features of patentable novelty that reside inthe present invention, including all features that would be treated asequivalents thereof by those skilled in the art to which this inventionpertains.

What is claimed is:
 1. In a semiconductor memory device comprising asense circuit to which first and second bit lines are connected at firstand second nodes, respectively, said sense circuit comprises:a first MOStransistor of a first conductivity type connected between a firstvoltage line and a third node; second and third MOS transistors of asecond conductivity type, the source and drain of said second MOStransistor being connected between said first and third nodes, thesource and drain of said third MOS transistor being connected betweensaid second and third nodes; a fourth MOS transistor of the secondconductivity type connected between a second voltage line and a fourthnode; and fifth and sixth MOS transistors of the first conductivitytype, the source and drain of said fifth MOS transistor being connectedbetween said first and fourth nodes, the source and drain of said sixthMOS transistor being connected between said second and fourth nodes, thegate of said second and fifth MOS transistors being connected to saidsecond nodes, the gate of said third and sixth MOS transistors beingconnected to said first node.
 2. In a semiconductor memory devicecomprising a sense circuit to which first and second bit lines areconnected at first and second nodes, respectively, said sense circuitcomprises:a first MOS transistor of a first conductivity type connectedbetween a first voltage line and a third node; second and third MOStransistors of the first conductivity type, the source and drain of saidsecond MOS transistor being connected between said first and thirdnodes, the source and drain of said third MOS transistor being connectedbetween said second and third nodes; a fourth MOS transistor of a secondconductivity type connected between a second voltage line and a fourthnode; and fifth and sixth MOS transistors of the second conductivitytype, the source and drain of said fifth MOS transistor being connectedbetween said first and fourth nodes, the source and drain of said sixthMOS transistor being connected between said second and fourth nodes, thegate of said second and fifth MOS transistors being connected to saidsecond nodes, the gate of said third and sixth MOS transistors beingconnected to said first node.